To evaluate the impact on
electrical stability of the contact system when exposed to a thermal
environment which may generate temperature depended failure mechanisms
- Dry oxidation of base
metals and/or underplates which have reached the contacting surfaces
due to impurities or by diffusion, pore corrosion or intermetallic
- Dry oxidation and/or
film formation of particulates which may have been deposited on the
contacting surfaces from the
- Dry oxidation due to
smearing of base metal and/or underplates on the contacting surfaces or
exposure of same due to wear.
- Reduced normal force
due to stress relaxation.
- Dry oxidation of the
contacting surface when non-noble finish systems are utilized.
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Typical test plans