ABOUT

PURPOSE:

To evaluate the impact on electrical stability of the contact system when exposed to a thermal environment which may generate temperature depended failure mechanisms such as:

1. Dry oxidation of base metals and/or underplates which have reached the contacting surfaces due to impurities or by diffusion, pore corrosion or intermetallic formation.
   
   
2. Dry oxidation and/or film formation of particulates which may have been deposited on the contacting surfaces from the surrounding atmosphere.
   
   
3. Dry oxidation due to smearing of base metal and/or underplates on the contacting surfaces or exposure of same due to wear.
   
   
4. Reduced normal force due to stress relaxation.
   
   
5. Dry oxidation of the contacting surface when non-noble finish systems are utilized.

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