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• Tests by Type
  
  
  • Electrical
    • Continuous Monitoring
      • Discontinuity
      • Glitch Detection
      • Nanosecond Event Detection
      • Near Continuous LLCR
      • Near Continuous Voltage Drop
    • High Speed
      • Attenuation (TDT)
      • Capacitance
      • Crosstalk (TDT)
      • Impedance
      • Inductance
      • Propagation Delay (TDR)
      • VSWR (TDR)
      • All TDR and TDT tests, range: to 20 GHz, rise time: 10ps
    • Power
      • Current Carrying Capacity
      • Current Cycling
      • Current Overload
      • Hot Swap
    • Signal
      • Contact Resistance (Rated Current)
      • Low Level Circuit Resistance
      • Voltage Drop
    • Misc. Electrical
      • Dielectric Withstanding Voltage
      • Insulation Resistance
      • Probe Test (LLCR vs. Normal Force)

• • Environmental
    • Fluid / Water
      • Simulated Rain
      • Fluid Immersion
      • Fluid Resistance
      • Resistance to Solvents
      • Soap Shower
      • Water Ingress
    • Harsh Environment
      • 1 or 2 Gas High Concentration
      • Gas Tight
      • Mixed Flowing Gas
      • Salt Spray
    • Humidity Tests
      • Corrosivity
      • Moisture Resistance
      • Steady State Humidity
      • Thermal Cycling w/ Humidity
    • Thermal Environments
      • Thermal Cycling
      • Temperature at Altitude
      • Temperature Life
      • Thermal Shock
    • Misc. Environmental
      • Air Leakage
      • Altitude Immersion
      • Dust
      • Flammability
      • Gas Tight (Wrapper Resistance)
      • Pressure / Vacuum Leak
      • Resistance to Solder Heat

• • Mechanical
    • Characterization
      • Contact Gaps
      • Contact Engagement Force
      • Contact Removal Force
      • Contact Retention Force
      • Contact Strength
      • Durability
      • Engagement Force
      • Mating Force
      • Normal Force
      • Resonance Scans
      • Separation Force
      • Unmating Force
      • Vibration at Resonance
    • Compliant / Press-Fit Pins
      • Cross Section Analysis
      • Press-Fit Pin Insertion
      • Press-Fit Pin Retention
      • Test Plan
    • Vibration / Mechanical Shock
      • Contact Chatter Monitoring
      • Drop Test
      • Random Vibration
      • Resonance Scans
      • Sine Vibration
      • Vibration at Resonance
      • Vibration at Temperature
    • Misc. Mechanical
      • Air Pressure (Leakage)
      • Axial Concentricity
      • Crimp Tensile
      • Insert Retention
      • Maintenance Aging
      • Probe Damage

• • Plating
    • Plating Thickness
    • Porosity
    • Solderability

• Tests by Industry
  • Automotive
  • Commercial
  • Computer
  • Military & Aerospace
  • Telecommunications
  • USB: Universal Serial Bus
  • 1394: Fire Wire

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